About the Society
The IEEE Electronics Packaging Society is the leading international forum for scientists and engineers engaged in the research, design and development of revolutionary advances in microsystems packaging and manufacturing.
Lead Associate Editor(s)
Yogendra Joshi, Georgia Institute of Technology, USA
Associate Editors
- Muhannad Bakir, Georgia Institute of Technology, USA
- Wendem Beyene, Meta, USA
- Premjeet Chahal, Michigan State University, USA
- Kuo-Ning Chiang, National Tsing Hua University, Taiwan
- Michel Nakhla, Carleton University, Canada
- Zhiguo Qian, Intel Corporation, USA
- Koneru Ramakrishna, Cirrus Logic, Inc., USA