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Polymeric Materials for HVDC Insulation

Submission Deadline:  31 May 2020

Submission Deadline: 31 May 2020

IEEE Access invites manuscript submissions in the area of Polymeric Materials for HVDC Insulation.

High voltage direct current (HVDC) power transmission plays a key role in the global power grid today and in the future, particularly for high-capacity, long-distance, and regional power grid interconnections. With the high voltage level of the HVDC power system, the most important concern is the operating safety of polymeric materials as well as solutions for HVDC insulation. During polarity reversal and over-voltages on the HVDC system, polymeric insulation can break down in cables, cable accessories, apparatus bushings and gas insulated switchgears. The issues regarding polymeric materials which include the DC conductivity, charge transportation and partial discharge, have become key problems in restraining the development of the HVDC power system.

The topics of interest include, but are not limited to:

  • Characterization of polymeric material for HVDC insulation including electrical, physical and chemical analysis
  • Flashover and tracking phenomenon in HVDC GIS&GIL and outdoor insulator
  • Partial discharge and breakdown in HVDC bushing
  • Electrical tree development and breakdown processes in HVDC insulation materials
  • Surface charge, space charge and interfacial charge in HVDC insulation materials
  • Ageing and life expectancy of HVDC insulation materials
  • Nanotechnologies and nanodielectrics for HVDC insulation materials
  • New materials for HVDC insulation
  • Environmentally friendly polypropylene cable

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Associate Editor:  Boxue Du, Tianjin University, China

Guest Editors:

    1. George Chen, University of Southampton, UK
    2. Hulya Kirkici, University of South Alabama, USA

 

Relevant IEEE Access Special Sections:

  1. Advanced Energy Storage Technologies and Their Applications
  2. Emerging Technologies for Energy Internet
  3. Intelligent and Cognitive Techniques for Internet of Things


IEEE Access Editor-in-Chief:
  Prof. Derek Abbott, University of Adelaide

Article submission: Contact Associate Editor and submit manuscript to:
http://mc.manuscriptcentral.com/ieee-access

For inquiries regarding this Special Section, please contact: duboxue@tju.edu.cn.